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Wafer Packing & Handling Solutions

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Semiconductor / Wafer Handling Market

 

Our expertise in the area of wafer packing enables NBS to continuously develop new solutions for the Semiconductor industry.

 

NBS has acquired considerable skill and know-how in the wafer packing and sorting, HSMS/SECS/GEM/300mm communication and ultra thin wafer handling arenas.

 

We offer solutions for wafer sizes of 125mm, 150mm, 200mm and 300mm.

 

Moreover, NBS can provide you with a solution for wafer inspection. Thanks to the continued development of our expertise, our wafer back side visual inspection equipment automatically detects silicon micro-cracks and peripheral breakages on the back side of wafers.

Semiconductor

Contact Us for information on all of our Smart Card Manufacturing & Wafer Handling/Packing Solutions today.

 

NEW!
High Speed Top Mono Printer CPE & High Speed Bottom Mono Printer CPE

NEW! ZXP Series 8 Re-Transfer Printer

Horizon™ Evolution HD

High Volume Card Personalization System

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